Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems
AssigneeKulicke and Soffa Industries, Inc.
InventorMatthew Tarabulski
Life of this patent
Estimating the term…
Abstract
A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system is provided. The method includes the steps of: (a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system; (b) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly; and (c) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly in response to the vacuum leakage sensed in step (b).
Claims23
A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, the method comprising the steps of:
- (a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system;
- (b) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly;
- and
- (c) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly in response to the vacuum leakage sensed in step (b).
(canceled)
A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, the method comprising the steps of:
- (a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system;
- (b) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly according to a tilt profile;
- and
- (c) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during step (b).
-36. (canceled)
A bonding system for bonding a semiconductor element to a substrate, the bonding system comprising:
- (a) a bonding tool assembly for bonding a semiconductor element to a substrate;
- (b) a support structure assembly for supporting the substrate;
- and
- (c) a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during contact therebetween, and in connection with a tilt adjustment between the bonding tool assembly and the support structure assembly.
-57. (canceled)
Dependencies are inferred from the claim text.