Latent reactive adhesive film
AssigneeTesa SE
InventorsMarco Kupsky, Thilo Dollase, Matthias Koop, Philipp Preuss
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Abstract
The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.
Claims26
A latently reactive adhesive film, comprising:
- a layer of an adhesive, the adhesive comprising one or more polymers and at least one peroxide,
- wherein the one or more polymers comprises at least 50% by weight of thermoplastic polymers having no C═C multiple bonds,
- wherein the at least one peroxide has the general structural formula R—O—O—R′ where R and R′ each represent organyl groups or collectively represent a cyclic organyl group,
- further wherein the at least one peroxide in solution has a 1 minute half-life temperature of less than 200° C., and
- further wherein the at least one peroxide exhibits a half-life at 80° C. of at least 13.5 hours.
A one-component latently reactive adhesive film comprising:
- (i) an adhesive composition comprising:
- a polymer component comprising at least 50% by weight of at least one thermoplastic polymer lacking C═C bonds and lacking C≡C bonds;
- and
- at least one peroxide having a general structure R—O—O—R′, where R and R′ are organyl groups;
- and
- (ii) a reinforcing layer, carrier layer, or liner disposed on one side of the adhesive composition;
- wherein, the adhesive composition is storage stable and does not cure or cures over a period of months under standard climatic conditions of 23° C. and 50% relative humidity;
- wherein, the adhesive composition is thermally reactive, and upon thermal activation, the adhesive composition melts and a cross-linking reaction involving the at least one thermoplastic polymer occurs;
- and
- wherein, the one side of the adhesive composition is configured to be adhered to a first substrate;
- and
- wherein, the other side of the adhesive composition is configured to be adhered to a second substrate, such that the first substrate and the second substrate are attached to each other and neither the first substrate nor the second substrate are adhesives.
A latently reactive adhesive film comprising:
- an adhesive composition comprising:
- a polymer component comprising at least 50% by weight of at least one thermoplastic polymer lacking C═C bonds and lacking C≡C bonds;
- and
- at least one peroxide comprising a ketone peroxide or a cyclic peroxide;
- wherein, the adhesive composition is storage stable and does not cure or cures over a period of months under standard climatic conditions of 23° C. and 50% relative humidity;
- and
- wherein, the adhesive composition is thermally reactive, and upon thermal activation, the adhesive composition melts and a cross-linking reaction involving the at least one thermoplastic polymer occurs.
Dependencies are inferred from the claim text.