Planar combiner system for solid state power amplifiers

A planar combiner system in solid-state amplifiers, for use in high-power multi-component power amplifier architectures, a wideband, low-loss, isolated and compact asymmetric Lange coupling and Wilkinson-type connector with asymmetric Lange coupling and Wilkinson-type coupling plenary placed on a base with high thermal conductivity and electrical resistance, which can directly contact the cold plate, comprising;

• multiple connectors (C) structured to transmit a signal originating from the connectors in a splitting role, and
• at least one combining module (CM) structured to be manufactured in planar arrangement on a base of high thermal conductivity and electrical resistivity, to collect and transmit amplified signals to a radio frequency output channel;
• multiple connection paths (CL) structured to be produced in planar arrangement on the base with high thermal conductivity and electrical resistance, to perform signal transport between connectors with minimum power loss;
• at least one division module (DM) structured to be manufactured in planar arrangement on the base with high thermal conductivity and electrical resistance, to divide and distribute the signal from a radio frequency input channel into multiple channels of equal power, and
• multiple power amplifiers (PA) structured to connect the division module (DM) and the combining module (CM) with the connector (C), amplifying divided signals from the division module (DM), and transferring the amplified signals to the combining module (CM).