Ultrasonic transducer

An ultrasonic transducer system, comprising:

• an ultrasonic transducer comprising:
• at least one ultrasonic transducer element;
• a semiconductor chip comprising the at least one ultrasonic transducer element;
• and
• a housing,
• wherein the semiconductor chip is arranged in the housing,
• wherein the semiconductor chip is embedded in a dimensionally stable encapsulation, and
• wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing;
• and
• a carrier,
• wherein the carrier is configured for mechanically securing by adhesively bonding, screwing, or clipping the ultrasonic transducer system to the casing.

A method for fitting an ultrasonic transducer the method comprising:

• forming a semiconductor chip of the ultrasonic transducer, wherein the semiconductor chip comprises at least one ultrasonic transducer element of the ultrasonic transducer;
• providing a housing of the ultrasonic transducer, wherein the semiconductor chip is arranged in the housing;
• providing a dimensionally stable encapsulation within the housing of the ultrasonic transducer, wherein the semiconductor chip is embedded in the dimensionally stable encapsulation, wherein the housing comprises a base to which the semiconductor chip is coupled and sidewalls that define an opening, wherein a contact surface of the dimensionally stable encapsulation is arranged in the opening or protrudes through the opening;
• arranging the ultrasonic transducer within a casing, wherein the contact surface of the dimensionally stable encapsulation is arranged in indirect contact with the casing and is configured for acoustically coupling the ultrasonic transducer to the casing;
• and
• providing a coupling intermediate layer between the casing and the ultrasonic transducer, wherein the coupling intermediate layer provides a mechanical coupling between the casing and the contact surface of the dimensionally stable encapsulation.