Engineered wood adhesives and engineered wood therefrom

An engineered wood precursor mixture comprising:

• a plurality of wood substrates;
• a binder reaction mixture present in a range of from 3 parts to 25 parts per 100 parts of the dry weight of the plurality of wood substrates, the binder composition comprising:
• an aqueous portion comprising:
• a carbohydrate-containing component in a range of from 2 wt% to 85 wt% based on a dry weight of the binder reaction mixture, the carbohydrate-containing component comprising glucose, fructose, or a mixture thereof, and the combined wt% of glucose, fructose, or mixture thereof in the carbohydrate-containing component is at least 60 wt%;
• a base is present at 1 wt% to 33 wt% of a base based on a dry weight of the binder reaction mixture;
• and
• 0.1 wt% to 10 wt% sodium trimetaphosphate based on a dry weight of the binder reaction mixture;
• and
• an at least partially non-dissolved polypeptide-containing component comprising soy flour, in a range of from 20 wt% to 85 wt% based on the dry weight of the binder reaction mixture.