Method for manufacturing a multi-layered film structure and method for manufacturing multi-layered microstrucures

A microstructure for delivery of an active ingredient to a user, said microstructure being produced in accordance with a method for manufacturing a multi-layered film structure, said method comprising:

• a) providing a handling substrate having a length and a width, which handling substrate is of a deformable material having a deformable top surface, or which handling substrate holds a deformable top surface layer;
• b) providing a plurality of film layers on top of the deformable surface of the handling substrate, said plurality of film layers comprising a core film layer holding an active ingredient;
• wherein
• one or more of the film layers are provided by a slot die coating process, said slot die coating process of a film layer comprising:
• supplying one or more materials for forming the film layer to a slot die head;
• and
• dispensing the supplied materials in a liquid form from the slot die head while moving the slot die head relative to the handling substrate, said dispensed liquid form material being deposited as a wet film layer on top of the handling substrate, or on top of the deformable top surface layer, or on top of one or more previously provided film layers;
• wherein the method for manufacturing the multi-layered film structure further comprises:
• c) subjecting the plurality of film layers to a punching step for generation of a plurality of microstructures, said punching being performed by use of a rigid stamp having a plurality of protrusions defining a plurality of cavities, wherein the depth of the cavities is larger than the thickness of the plurality of film layers, and lower than the combined thickness of the plurality of film layers and the deformable surface part of the handling substrate, thereby allowing the protrusions of the rigid stamp to penetrate all the way through the plurality of film layers during punching to divide the plurality of film layers into a plurality of separated microstructures.

A method for manufacturing a multi-layered film structure, said method comprising:

• a) providing a handling substrate having a length and a width, which handling substrate is of a deformable material having a deformable top surface, or which handling substrate holds a deformable top surface layer;
• b) providing a plurality of film layers on top of the deformable surface of the handling substrate;
• wherein
• one or more of the film layers are provided by a slot die coating process, said slot die coating process of a film layer comprising:
• supplying one or more materials for forming the film layer to a slot die head;
• and
• dispensing the supplied materials in a liquid form from the slot die head while moving the slot die head relative to the handling substrate, said dispensed liquid form material being deposited as a wet film layer on top of the handling substrate, or on top of the deformable top surface layer, or on top of one or more previously provided film layers;
• wherein the method for manufacturing a multi-layered structure further comprises:
• c) subjecting the plurality of film layers to a punching step for generation of a plurality of microstructures, said punching being performed by use of a rigid stamp having a plurality of protrusions defining a plurality of cavities, wherein the depth of the cavities is larger than the thickness of the plurality of film layers, and lower than the combined thickness of the plurality of film layers and the deformable surface part of the handling substrate, thereby allowing the protrusions of the rigid stamp to penetrate all the way through the plurality of film layers during punching to divide the plurality of film layers into a plurality of separated microstructures;
• and
• wherein the microstructures hold an outer shell layer and a lid layer, the microstructures are separated from the deformable surface layer by being attached within the protrusions of the stamp, and the lid layer of the microstructures is bonded to a release layer.

A method for manufacturing a multi-layered film structure, said method comprising:

• a) providing a handling substrate having a length and a width, which handling substrate is of a deformable material having a deformable top surface, or which handling substrate holds a deformable top surface layer;
• b) providing a plurality of film layers on top of the deformable surface of the handling substrate;
• wherein
• one or more of the film layers are provided by a slot die coating process, said slot die coating process of a film layer comprising:
• supplying one or more materials for forming the film layer to a slot die head;
• and
• dispensing the supplied materials in a liquid form from the slot die head while moving the slot die head relative to the handling substrate, said dispensed liquid form material being deposited as a wet film layer on top of the handling substrate, or on top of the deformable top surface layer, or on top of one or more previously provided film layers;
• wherein the method for manufacturing a multi-layered structure further comprises:
• c) subjecting the plurality of film layers to a punching step for generation of a plurality of microstructures, said punching being performed by use of a rigid stamp having a plurality of protrusions defining a plurality of cavities, wherein the depth of the cavities is larger than the thickness of the plurality of film layers, and lower than the combined thickness of the plurality of film layers and the deformable surface part of the handling substrate, thereby allowing the protrusions of the rigid stamp to penetrate all the way through the plurality of film layers during punching to divide the plurality of film layers into a plurality of separated microstructures;
• and
• wherein the microstructures hold an outer shell layer, and the microstructures are separated from the deformable surface layer by bonding the outer shell layer of the microstructures onto a release layer.