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US 2023/0309245 A1Published application
Optical sensor package assembly
AssigneeLuxsentek Microelectronics Corp.
InventorsSheng-Cheng Lee, Wen-Sheng Lin, Chao-Yang Hsiao, Chih-Wei Lin, Chen-Hua Hsi, Yueh-Hung Ho
Life of this patent
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Abstract
The present invention provides an optical sensor package assembly. The light shield is arranged in the groove of a package housing above the photosensitive chip. The connection wires between the substrate, the light emitting unit and the photosensitive chip can be printed or disposed on the surface of the substrate. Further, a distance between the photosensitive element and the chip edge is designed to reduce or avoid side leakage interference.
Claims7
An optical sensor package assembly, comprising:
- a substrate;
- a light-emitting unit and a photosensitive chip arranged on the surface of the substrate;
- bonding wires disposed on the surface of the substrate between the photosensitive chip and the light-emitting unit, wherein the bonding wires are configured to electrically connect the photosensitive chip, the light-emitting unit and the substrate;
- and
- a transparent package housing covering the substrate, the light-emitting unit, the photosensitive chip and the bonding wires, wherein the photosensitive chip has a photosensitive element, the transparent package housing has a groove above the photosensitive chip, the groove is filled with an opaque material and the light-emitting unit is lower than the top of the groove and higher than the base of the groove to reduce or avoid the cross-talk effect.
2 more elements
An optical sensor package assembly, comprising:
- a substrate;
- a light-emitting unit and a photosensitive chip arranged on the surface of the substrate;
- and
- a transparent package housing covering the substrate, the light-emitting unit and the photosensitive chip, wherein the photosensitive chip has a photosensitive element, the transparent package housing has a groove above the photosensitive chip between the light emitting unit and the photosensitive element, the groove is filled with an opaque material and the photosensitive element is disposed at one corner of the chip with a specific distance to both adjacent sides of the photosensitive chip wherein the distance can be used to reduce or avoid side leakage interferences.
1 more element
Dependencies are inferred from the claim text.