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US 2023/0309221 A1Published application
Materials for printed circuit boards
AssigneeThintronics, Inc.
InventorsTarun Amla, Stefan J. Pastine
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Abstract
Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
Claims19
A printed circuit board, comprising a dielectric polymer film having:
- (i) a glass transition temperature less than or equal to about 130° C.;
- (ii) a dielectric constant less than 2.8;
- and
- (iii) a substantially isotropic elastic modulus less than or equal to about 6 GPa when the average temperature of the dielectric polymer film is below the glass transition temperature.
1 more element
Dependencies are inferred from the claim text.