High-entropy alloy and method of heat-treating same
AssigneeLG Electronics Inc.
InventorsHyunkwon SHIN, Namseok KANG, Jinmok OH, Jinhyeok CHOI
Life of this patent
Estimating the term…
Abstract
A high-entropy alloy, according to the present embodiment, comprises a first phase and a second phase respectively comprising iron and copper, and iron and a first metal other than copper, and having mutually different compositions. A reinforcement compound formed by the chemical bonding of the first metal and a non-metal can be selectively included in the first phase.
Claims20
A high-entropy alloy comprising a first phase and a second phase respectively containing iron and copper, and iron and a first metal other than copper, and having different compositions,
- wherein a reinforcement compound formed by chemical bonding of the first metal and a non-metal is selectively included in the first phase.
A method of heat-treating a high-entropy alloy, the method comprising:
- a preparation step of preparing a high-entropy alloy material comprising a first phase and a second phase respectively containing iron and copper, and iron and a first metal other than copper, and having different compositions;
- and
- a selective reinforcement step of forming a reinforcement compound in the first phase by performing heat-treatment using a non-metal for a chemical reaction between the first metal, contained in the first phase, and the non-metal.
Dependencies are inferred from the claim text.