Display backplane assembly, led display module, and related methods for manufacturing the same

A light-emitting diode (LED) display module, comprising an LED chip and a display backplane assembly, wherein the display backplane assembly comprises:

• a display backplane, the display backplane having a first surface, and electrode connecting pads being disposed on the first surface;
• and
• a planarization layer stacked on the first surface, wherein the planarization layer defines a plurality of accommodating holes extending in a thickness direction of the planarization layer, wherein the plurality of accommodating holes correspond to the electrode connecting pads, each of the plurality of accommodating holes comprises a first hole and a second hole, wherein the first hole extends through the planarization layer in the thickness direction so that each of the electrode connecting pads is at least partially exposed relative to the planarization layer, the second hole extends through at least a side face of the planarization layer away from the display backplane, a bonding material is filled in the first hole and in contact with the electrode connecting pad, and an adhesive is filled in the second hole;
• wherein the bonding material is used to electrically connect an electrode of a light-emitting diode (LED) chip with the electrode connecting pad, and the adhesive is used to adhere the LED chip on the planarization layer;
• and
• the LED chip is disposed on a side face of the planarization layer away from the display backplane, and the LED chip has the electrode, wherein the electrode corresponds to at least part of the first hole and at least part of the second hole, the electrode is electrically connected with the electrode connecting pad through the bonding material, and the electrode is connected with the planarization layer through the adhesive.

A method for manufacturing a display backplane assembly, comprising:

• preparing a planarization layer on a first surface of a display backplane, wherein electrode connecting pads are disposed on the first surface;
• defining a plurality of accommodating holes on the planarization layer in a thickness direction of the planarization layer, wherein the plurality of accommodating holes correspond to the electrode connecting pads, each of the electrode connecting pads is at least partially exposed relative to the planarization layer, each of the plurality of accommodating holes comprises a first hole and a second hole, wherein the first hole extends through the planarization layer in the thickness direction so that the electrode connecting pad is at least partially exposed relative to the planarization layer, and the second hole extends through at least a side face of the planarization layer away from the display backplane;
• filling a bonding material in the first hole, wherein the bonding material contacts the electrode connecting pad;
• and
• filling an adhesive in the second hole.