Two-agent curable heat conductive grease composition, heat conductive grease, and electronic device

Abstract

A two-agent curable heat conductive grease composition including a first agent and a second agent, wherein the first agent contains 100 parts by weight of a liquid resin (A-1), 140 parts by weight to 560 parts by weight of metal aluminum (B-1) having an average particle size of 15 to 100 μm, one or more heat conductive fillers (C-1) selected from the group consisting of aluminum oxide, aluminum nitride, and boron nitride and having an average particle size within a range of 0.3 to 10 μm, and a hydrosilylation reaction catalyst (D-1); the second agent contains 100 parts by weight of a liquid resin (A-2), 140 parts by weight to 560 parts by weight of metal aluminum (B-2) having an average particle size of 15 to 100 μm, and one or more heat conductive fillers (C-2) selected from the group consisting of aluminum oxide, aluminum nitride, and boron nitride and having an average particle size within a range of 0.3 to 10 μm, and at least one of the heat conductive filler (C-1) or the heat conductive filler (C-2) includes a first heat conductive filler (C-1-1) or a first heat conductive filler (C-2-1) being at least one or more selected from the group consisting of aluminum oxide, aluminum nitride, and boron nitride and having an average particle size of 0.3 to 1.5 μm.

Dependencies are inferred from the claim text.