# US 2023/0264359 A1 · Conveyance apparatus, substrate processing apparatus, conveyance method, and article manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0264359 A1 - Document ID: US20230264359A1 - Status: Published application - Kind: A1 - Application number: 18/164,470 - Filed: 2023-02-03 - Published: 2023-08-24 - Earliest claimed: 2022-02-22 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: TAKASHI HOSAKA - Web page: https://patentgrep.com/patent/US20230264359A1 ## CPC - B25J 9/1697: {Vision controlled systems} - H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection} - B25J 11/0095: {Manipulators transporting wafers} - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/53: {using optical controlling means} - H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass - B25J: MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ({manipulators specially adapted for use in surgery A61B34/70; manipulators used in cleaning hollow articles B08B9/04}; manipulators associated with rolling mills B21B39/20; manipulators associated with forging machines B21J13/10; {manipulators associated with picking-up and placing mechanisms B23P19/007}; means for holding wheels or parts thereof B60B30/00; {vehicles with ground-engaging propulsion means, e.g. walking members B62D57/02, B62D57/032; devices for picking-up and depositing articles or materials between conveyors B65G47/90, B65G47/91; manipulators with gripping or holding means for transferring packages B65H67/065}; cranes B66C; {manipulators used in the protection or supervision of pipe-line installations F17D5/00; walking equipment adapted for nuclear steam-generators F22B37/006}; manipulators specially adapted for, or associated with, nuclear reactors G21C; {apparatus used for handling wafers during manufacture or treatment of semiconductor H10P72/50}) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract A conveyance apparatus connected to a substrate processing apparatus configured to bring a pressing member and a material on a substrate into contact with each other to form a cured film of the material on the substrate, the conveyance apparatus includes an acquisition unit configured to acquire a state of a peripheral portion of an adhesion substrate including the pressing member and the substrate adhering to the pressing member with the material interposed in between, a position adjusting unit configured to adjust a position of the adhesion substrate based on a result acquired by the acquisition unit, and a conveyance unit configured to convey the adhesion substrate adjusted by the position adjusting unit. ## Claims ### Claim 1 A conveyance apparatus connected to a substrate processing apparatus configured to bring a pressing member and a material on a substrate into contact with each other to form a cured film of the material on the substrate, the conveyance apparatus comprising: an acquisition unit configured to acquire a state of a peripheral portion of an adhesion substrate including the pressing member and the substrate adhering to the pressing member with the material interposed in between; a position adjusting unit configured to adjust a position of the adhesion substrate based on a result acquired by the acquisition unit; and a conveyance unit configured to convey the adhesion substrate adjusted by the position adjusting unit. ### Claim 2 (depends on 1) The conveyance apparatus according to claim 1, wherein the acquisition unit acquires the state of the peripheral portion of the adhesion substrate while rotating the adhesion substrate. ### Claim 3 (depends on 2) The conveyance apparatus according to claim 2, wherein the acquisition unit acquires the state of the peripheral portion of the adhesion substrate by acquiring an edge position of the peripheral portion. ### Claim 4 (depends on 2) The conveyance apparatus according to claim 2, wherein the acquisition unit acquires the state of the peripheral portion of the adhesion substrate by emitting light from a side where the pressing member of the adhesion substrate is located and measuring an optical path length of reflected light. ### Claim 5 (depends on 1) The conveyance apparatus according to claim 1, wherein the acquisition unit acquires an image of each of a plurality of regions including an edge of the peripheral portion of the adhesion substrate, and wherein the position adjusting unit adjusts the position of the adhesion substrate based on the image of each of the plurality of regions. ### Claim 6 (depends on 1) The conveyance apparatus according to claim 1, wherein the position adjusting unit adjusts the position by performing at least one of movement and rotation in a direction parallel to a surface of the adhesion substrate in a case where it is determined that an adjustment of the position is necessary based on the result acquired by the acquisition unit. ### Claim 7 (depends on 1) The conveyance apparatus according to claim 1, wherein the conveyance unit carries the adhesion substrate, whose position is adjusted by the position adjusting unit, to a holding housing. ### Claim 8 (depends on 7) The conveyance apparatus according to claim 7, wherein the position adjusting unit adjusts the position of the adhesion substrate to avoid interference between the holding housing and the adhesion substrate during carry-out to the holding housing. ### Claim 9 (depends on 1) The conveyance apparatus according to claim 1, wherein the conveyance unit carries the adhesion substrate to a release assisting mechanism configured to release the pressing member from the substrate of the adhesion substrate, and wherein the position adjusting unit adjusts the position of the adhesion substrate to enable release assistance by the release assisting mechanism. ### Claim 10 (depends on 1) The conveyance apparatus according to claim 1, wherein the substrate and the pressing member each have a circular shape. ### Claim 11 A conveyance method comprising: acquiring a state of a peripheral portion of an adhesion substrate including a pressing member and a substrate adhering to the pressing member with a material interposed in between; adjusting a position of the adhesion substrate based on a result of the acquiring; and conveying the adjusted adhesion substrate. ### Claim 12 A substrate processing apparatus configured to bring a pressing member and a material on a substrate into contact with each other to form a cured film of the material on the substrate, the substrate processing apparatus comprising: an acquisition unit configured to acquire a state of a peripheral portion of an adhesion substrate including the pressing member and the substrate adhering to the pressing member with the material interposed in between; a position adjusting unit configured to adjust a position of the adhesion substrate based on a result acquired by the acquisition unit; and a conveyance unit configured to convey the adhesion substrate adjusted by the position adjusting unit. ### Claim 13 (depends on 1) An article manufacturing method comprising: forming a cured film using the substrate processing apparatus to which the conveyance apparatus according to claim 1 is connected; and processing the substrate on which the cured film is formed, wherein an article is manufactured from the processed substrate.