Structural adhesives
AssigneeZephyros, Inc.
InventorMichael Czaplicki
Life of this patent
Estimating the term…
Abstract
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.
Claims32
A process for forming an adhesive formulation comprising blending:
- i) an adduct of an epoxy resin and an elastomer, wherein the adhesive formulation contains from about 7% to about 20% by weight of the adduct based on the adhesive formulation;
- ii) a solution of a phenoxy epoxy hybrid resin formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, wherein the adhesive formulation contains between 3% and 10% by weight of phenoxy resin;
- iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer;
- and
- iv) one or more additional epoxy resins.
The process for forming the adhesive formulation according to claim 5, wherein the adduct of the epoxy resin and the elastomer is derived from a butadiene acrylonitrile rubber.
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
-45. (canceled)
Dependencies are inferred from the claim text.