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US 2023/0226818 A1Published application
Mems device, liquid ejecting head, and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorsMotoki TAKABE, Yu SHIOZAWA
Life of this patent
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Abstract
A MEMS device includes a first substrate 22 including a single-crystal silicon substrate and a second substrate 23 including a single-crystal silicon substrate, in which the first substrate 22 and the second substrate 23 are laminated together, and the first substrate 22 and the second substrate 23 are joined to each other such that the cleavage directions of both substrates intersect each other.
Claims13
A MEMS device comprising:
- a first substrate including a single-crystal silicon substrate;
- and
- a second substrate including a single-crystal silicon substrate, the first substrate and the second substrate being laminated together, wherein
- the first substrate and the second substrate are joined to each other such that a cleavage direction of the first substrate intersects a cleavage direction of the second substrate.
1 more element
A liquid ejecting head comprising:
- a flow path member in which a liquid flow path including a pressure chamber is formed;
- and
- a pressure generating element provided on one side of the pressure chamber, the pressure generating element causing a pressure change in the pressure chamber via a diaphragm, the liquid ejecting head ejecting a liquid from a nozzle in communication with the pressure chamber to an ejection target medium, wherein
- the flow path member includes a first substrate including a single-crystal silicon substrate and a second substrate including a single-crystal silicon substrate, and
- the first substrate and the second substrate are provided on a side of the pressure chamber across the diaphragm, and the first substrate and the second substrate are joined to each other such that a cleavage direction of the first substrate intersects a cleavage direction of the second substrate.
2 more elements
Dependencies are inferred from the claim text.