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US 2023/0224565 A1Published application
Sensor module and case unit
AssigneeSony Semiconductor Solutions Corporation
InventorHaruki Tanaka
Life of this patent
Estimating the term…
Abstract
A sensor module according to an embodiment of the present technology includes a sensor element, a first case, a second case, and an intermediate layer. The first case includes an opening end and accommodates therein the sensor element. The second case includes a joining surface welded to the opening end. The intermediate layer is reflective of light, and is formed along an outer peripheral edge of a region, in the opening end, in which the opening end faces the joining surface.
Claims10
A sensor module, comprising:
- a sensor element;
- a first case that includes an opening end and accommodates therein the sensor element;
- a second case that includes a joining surface welded to the opening end;
- and
- a light-reflective intermediate layer that is formed along an outer peripheral edge of a region, in the opening end, in which the opening end faces the joining surface.
2 more elements
A case unit, comprising:
- a first case that includes an opening end;
- a second case that includes an annular joining surface welded to the opening end;
- and
- a light-reflective intermediate layer that is formed along an outer peripheral edge or an inner peripheral edge of a region, in the opening end, in which the opening end faces the joining surface.
1 more element
Dependencies are inferred from the claim text.