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US 2023/0219194 A1Published application
Electrodeposition whetstone and manufacturing method
AssigneeTokyo Diamond Tools Mfg. Co., Ltd.
InventorsMasaaki TSUDA, Jun KISHIMOTO, Takeshi YAGI
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Abstract
According to an embodiment, an electrodeposition whetstone includes a plating layer, first abrasive grains protruding from the plating layer, and second abrasive grains which are arranged between the first abrasive grains. The amount of protrusion of the second abrasive grains from the plating layer is smaller than the amount of protrusion of the first abrasive grains from the plating layer. A grain size of the second abrasive grains is smaller than a grain size of the first abrasive grains.
Claims11
An electrodeposition whetstone comprising:
- a plating layer;
- a base on which the plating layer is provided;
- first abrasive grains protruding from the plating layer;
- and
- second abrasive grains arranged between the first abrasive grains,
- the amount of protrusion of the second abrasive grains from the plating layer being smaller than the amount of protrusion of the average grain size of the first abrasive grains from the plating layer, and
- a grain size of the second abrasive grains being smaller than a grain size of the first abrasive grains,
- wherein:
- the plating layer includes a first plating layer provided on the base and a second plating layer provided on the first plating layer,
- the electrodeposition whetstone includes:
- a first virtual plane formed by a plurality of protruding ends of the first abrasive grains, and
- a second virtual plane formed by a plurality of protruding ends of the second abrasive grains,
- the first virtual plane is located outside with respect to the second virtual plane,
- a distance between the first virtual plane and the second virtual plane is equal to or smaller than a range determined based at least on the average grain size of the first abrasive grains, the average grain size of the second abrasive grains, and a thickness of the plating layer, and
- the range increases as a thickness of the first plating layer increases.
12 more elements
A manufacturing method comprising:
- securing a plurality of first abrasive grains to a base by a first plating layer, with gaps formed between the first abrasive grains, and forming a first virtual plane by a plurality of protruding ends of the first abrasive grains;
- arranging second abrasive grains in the gaps, a grain size of the second abrasive grains being smaller than a grain size of the first abrasive grains;
- and
- securing the first abrasive grains and the second abrasive grains by second plating different from the first plating layer in such a manner that the amount of protrusion of the second abrasive grains is smaller than the amount of protrusion of the first abrasive grains, forming a plating layer from the first plating layer and the second plating layer, and forming a second virtual plane by a plurality of protruding ends of the second abrasive grains,
- wherein:
- an average distance between the first virtual plane and the second virtual plane is equal to or smaller than a range determined based at least on an average grain size of the first abrasive grains, an average grain size of the second abrasive grains, and a thickness of the plating layer, and
- the range increases as a thickness of the first plating layer increases.
4 more elements
Dependencies are inferred from the claim text.