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US 2023/0211431 A1Published application
Solder printing machine
AssigneeFuji Corporation
InventorShoji FUKAKUSA
Life of this patent
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Abstract
A solder printing machine, which is configured to print paste-state solder on a board by use of a mask and a squeegee configured to move on an upper surface of the mask, includes a bed, a mask frame fixedly provided on the bed and configured to hold the mask, and a squeegee frame fixedly provided on the bed, formed separately from the mask frame, and configured to support a driving mechanism configured to drive the squeegee.
Claims7
A solder printing machine configured to print paste-state solder on a board by use of a mask and a squeegee configured to move on an upper surface of the mask, the solder printing machine comprising:
- a bed;
- a mask frame fixedly provided on the bed and configured to hold the mask;
- and
- a squeegee frame fixedly provided on the bed, formed separately from the mask frame, and configured to support a driving mechanism configured to drive the squeegee.
1 more element
Dependencies are inferred from the claim text.