Counter electrode material for electrochromic devices
AssigneeView, Inc.
InventorsAnshu A. Pradhan, Robert T. Rozbicki, Dane Gillaspie, Sridhar K. Kailasam
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Abstract
Various embodiments herein relate to electrochromic devices, methods of fabricating electrochromic devices, and apparatus for fabricating electrochromic devices. In a number of cases, the electrochromic device may be fabricated to include a particular counter electrode material. The counter electrode material may include a base anodically coloring material. The counter electrode material may further include one or more halogens. The counter electrode material may also include one or more additives.
Claims40
A method of fabricating an electrochromic stack, the method comprising:
- forming a cathodically coloring layer comprising a cathodically coloring electrochromic material;
- and
- forming an anodically coloring layer comprising an anodically coloring electrochromic material and one or more halogens, the anodically coloring layer optionally comprising one or more additives, wherein the anodically coloring material comprises at least one metal selected from the group consisting of chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), rhodium (Rh), ruthenium (Ru), vanadium (V), and iridium (Ir), and wherein the optional additive comprises a material selected from the group consisting of silver (Ag), arsenic (As), gold (Au), boron (B), cadmium (Cd), cesium (Cs), copper (Cu), europium (Eu), gallium (Ga), gadolinium (Gd), germanium (Ge), mercury (Hg), osmium (Os), lead (Pb), palladium (Pd), promethium (Pm), polonium (Po), platinum (Pt), radium (Ra), rubidium (Rb), terbium (Tb), technetium (Tc), thorium (Th), thallium (Tl), tungsten (W), and combinations thereof.
An electrochromic stack, comprising:
- a cathodically coloring layer comprising a cathodically coloring material;
- and
- an anodically coloring layer comprising an anodically coloring electrochromic material and one or more halogens, the anodically coloring layer optionally comprising one or more additives, wherein the anodically coloring material comprises at least one metal selected from the group consisting of chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), rhodium (Rh), ruthenium (Ru), vanadium (V), and iridium (Ir), and wherein the optional additive comprises a material selected from the group consisting of silver (Ag), arsenic (As), gold (Au), boron (B), cadmium (Cd), cesium (Cs), copper (Cu), europium (Eu), gallium (Ga), gadolinium (Gd), germanium (Ge), mercury (Hg), osmium (Os), lead (Pb), palladium (Pd), promethium (Pm), polonium (Po), platinum (Pt), radium (Ra), rubidium (Rb), terbium (Tb), technetium (Tc), thorium (Th), thallium (Tl), tungsten (W), and combinations thereof.
An integrated deposition system for fabricating an electrochromic stack, the system comprising:
- a plurality of deposition stations aligned in series and interconnected and operable to pass a substrate from one station to the next without exposing the substrate to an external environment, wherein the plurality of deposition stations comprise
- (i) a first deposition station containing one or more material sources for depositing a cathodically coloring layer;
- (ii) a second deposition station containing one or more material sources for depositing an anodically coloring layer, wherein the one or more material sources for depositing the anodically coloring layer comprise at least a first metal and a halogen, the one or more material sources for depositing the anodically coloring layer optionally comprising one or more additives, wherein the first metal is selected from the group consisting of chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), rhodium (Rh), and iridium (Ir), ruthenium (Ru), vanadium (V), and combinations thereof, and wherein the optional additive is selected from the group consisting of silver (Ag), arsenic (As), gold (Au), boron (B), cadmium (Cd), cesium (Cs), copper (Cu), europium (Eu), gallium (Ga), gadolinium (Gd), germanium (Ge), mercury (Hg), osmium (Os), lead (Pb), palladium (Pd), promethium (Pm), polonium (Po), platinum (Pt), radium (Ra), rubidium (Rb), terbium (Tb), technetium (Tc), thorium (Th), thallium (Tl), tungsten (W), and combinations thereof;
- and
- a controller containing program instructions for passing the substrate through the plurality of stations in a manner that deposits on the substrate (i) the cathodically coloring layer, and (ii) the anodically coloring layer to form a stack comprising at least the cathodically coloring layer and the anodically coloring layer.
The integrated deposition system of any of claims 29-35, wherein the one or more material sources for depositing the anodically coloring layer comprise the one or more additive, wherein the additive comprises a material selected from the group consisting of Ga, Gd, Ge, Cu, and combinations thereof.
Dependencies are inferred from the claim text.