Electronically active, solvent resistant organic films processed from alcohol or aqueous media
AssigneeUTI Limited Partnership
InventorsCayley HARDING, Gregory C. WELCH
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Abstract
Thin films of organic semiconducting material comprising perylene diimide small molecules with pyrrolic N—H bonds. Films are prepared using green solvents including water and alcohols. The films can be solvent-resistant and generally range in thickness from 10 to 1000 nm. Perylene diimide molecules are dissolved in solvent by addition of a base to polarize the pyrrolic N—H bond believed to generate an ionic salt in alcohol or aqueous solution. Devices containing such films are provided. Methods of making films and methods of using films in OPV device applications and in amine sensors are provided.
Claims31
A method for preparing a film comprising an N-annulated perylene diimide (PDI) compound having a pyrrole N—H bond comprising:
- dissolving a selected amount of the N-annulated PDI compound in a selected amount of a solvent selected from water, a C1-C6 alcohol or a miscible combination thereof by addition to the solvent containing the N-annulated compound of an amount of base at least sufficient to polarize the pyrrole N—H bond giving an ionic salt dissolved in the solvent to form a film-precursor solution;
- forming a layer using the film-precursor solution;
- and
- removing solvent from the layer to form the film.
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A solvent-resistant organic semiconducting film comprising non-polymeric perylene diimide molecules with a pyrrolic N—H bond or a salt thereof.
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A film-precursor formulation which comprises a pyrrole-deprotonated N-annulated PDI compound and at least one equivalent of base to deprotonate the N-annulated PDI compound dissolved in a solvent selected from water, a C1-C6 alcohol or a miscible mixture thereof.
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Dependencies are inferred from the claim text.