Integrated Attenuator with Thermal Vias
AssigneeInternational Business Machines Corporation
InventorYoung Kwark
Life of this patent
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Abstract
An attenuator comprising a first thermal reservoir and a first metal layer located on top of the first thermal reservoir. A first dielectric layer located on top of the first metal layer and a resistor located on top the first dielectric layer. A second dielectric layer located on top of the resistor and a second metal layer located on top of the second dielectric layer. A second thermal reservoir located on top the third metal layer and wherein the resistor is split or perforated by a thermal shunt, wherein the thermal shunt includes a thermal column that directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.
Claims15
An attenuator comprising:
- a first thermal reservoir;
- a first metal layer located on top of the first thermal reservoir;
- a first dielectric layer located on top of the first metal layer;
- a resistor located on top the first dielectric layer;
- a second dielectric layer located on top of the resistor;
- a second metal layer located on top of the second dielectric layer;
- a second thermal reservoir located on top the third metal layer;
- wherein the resistor is split or perforated by a thermal shunt, wherein the thermal shunt includes a thermal column that directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.
An attenuator comprising:
- a first thermal reservoir;
- a first metal layer located on top of the first thermal reservoir;
- a first dielectric layer located on top of the first metal layer;
- a resistor located on top the first dielectric layer;
- a second dielectric layer located on top of the resistor;
- a second metal layer located on top of the second dielectric layer;
- a second thermal reservoir located on top the third metal layer;
- a top thermal via that extends upwards from resistor through the second dielectric layer to the second thermal reservoir, wherein the top thermal via is filled with a thermal interface material;
- and
- a bottom thermal via that extends downwards from the dividing metal plate through the first dielectric layer to the first thermal reservoir, wherein the bottom thermal via is filled with a thermal interface material.
Dependencies are inferred from the claim text.