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US 2023/0187257 A1Published application
Laser-releasable bonding materials for 3-d ic applications
AssigneeBrewer Science Inc.
InventorsLuke Prenger, Arthur O. Southard, Qi Wu, Xiao Liu
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Abstract
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
Claims3
A polymer comprising recurring monomers of
- where each of R1 to R4:
- can be the same or different;
- and
- is individually selected from the group consisting of hydrogen, alkyls, alkoxys, hydroxyls, and polyethylene glycol chains.
1 more element
Dependencies are inferred from the claim text.