Method of Manufacturing a Component Carrier Metal Trace and a Component Carrier
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMinwoo LEE, Artan BAFTIRI
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Abstract
A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.
Claims20
A method of manufacturing a component carrier, the method comprising:
- providing a metal layer;
- providing a film on the metal layer;
- patterning the film in order to expose an area of the metal layer;
- carrying out a first etch, thereby removing a part of the exposed metal layer and maintaining a thickness of the film;
- and thereafter
- carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer.
A component carrier, comprising:
- a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- wherein the at least one electrically conductive layer structure comprises a metal trace and a further metal trace arranged side by side;
- wherein each of the metal trace and the further metal trace has a bottom-sided line width of 40 μm or less;
- wherein the metal trace and the further metal trace are spaced by a bottom-sided spacing of 45 μm or less;
- wherein each of the metal trace and the further metal trace has a top-sided line width of at least 80% of its respective bottom-sided line width;
- and
- wherein each of the metal trace and the further metal trace has a vertical thickness of 30 μm or more.
Dependencies are inferred from the claim text.