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US 2023/0178697 A1Published application
Method of making a packaged device
AssigneeTslc Corporation
InventorsChen-Fu CHU, Trung Tri Doan
Life of this patent
Estimating the term…
Abstract
A packaged LED device comprising: a pad-extended LED chip comprising: at least one LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer; a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer; and a first extended metal layer connected to the first pad and a second extended metal layer connected to the second pad.
Claims20
A pad-extended LED chip comprising:
- a LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer;
- a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer;
- and
- a first extended metal layer connected to the first pad and a second extended metal layer connected to the second pad.
1 more element
A packaged LED device comprising:
- a pad-extended LED chip wherein:
- at least one LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer;
- and
- a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer;
- and
- a first extended metal layer connected to the first pad and a second extended metal layer connected to the second pad;
- a polymer layer covered substantial the surfaces of the pad-extended LED chip except the second surface of the first extended metal layer and the second surface of the second extended metal layer;
- and
- a first extended pad electrically connected to the first extended metal layer and a second extended pad electrically connected to the second extended metal layer.
6 more elements
A packaged LED device comprising:
- a pad-extended LED chip wherein:
- at least one LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer;
- and
- a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer;
- and
- a first extended metal layer connected to the first pad and a second extended metal layer connected to the second pad;
- a polymer layer covered substantial the surfaces of the pad-extended LED chip except the second surface of the first extended metal layer and the second surface of the second extended metal layer;
- an opaque layer disposed on top of the polymer layer;
- a first extended pad in contact with the polymer and disposed on the second surface of the first extended metal layer and electrically connected to the first type semiconductor layer;
- and
- a second extended pad in contact with the polymer and disposed on the second surface of the second extended metal layer and electrically connected to the second type semiconductor layer.
8 more elements
Dependencies are inferred from the claim text.