Jig for manufacturing probe card, probe alignment system comprising same, and probe card manufactured thereby

A probe alignment apparatus comprising:

• a main frame as a frame with a plurality of beams assembled;
• a vacuum pump detachably mounted to the main frame;
• a plate with rectangular shape detachably mounted to the main frame;
• an arm member detachably mounted on the main frame and comprising a first arm extending in a direction perpendicular to the plate and a second arm extending in parallel to the plate while being perpendicular to the first arm;
• a jig provided in the main frame to align the probes so that the plurality of probes are accommodated in guide holes formed at predetermined positions to make the probes stand upright, and from the guide holes, the probes are bonded to the MPH in an upright state;
• a probe storage that accommodates a plurality of upright probes arranged in a line in one direction so that the probes are inserted into the guide holes in an upright state, and is positioned so that the probes are supplied to the guide holes;
• a first stage mounted on the plate of the main frame to align the jig to the insertion position of a probe to be discharged from the probe storage in an arbitrary guide hole by moving the jig left and right, forward and backward, and rotating axially;
• a probe carrier configured to insert a probe positioned at an outermost side among probes accommodated in the probe storage into the guide hole;
• an actuator to which the probe carrier is mounted and which moves the probe carrier;
• a second stage to which the actuator is mounted in a state of being mounted on the arm member, and that moves the probe carrier mounted on the actuator to an insertion or extraction position of a probe to be ejected from the probe storage by moving the actuator back and forth, left and right and up and down;
• a fastening part configured to mechanically mount the probe storage to the main frame or the second stage;
• a vision part configured to identify the probe arranged at the outermost side among the probes accommodated in the probe storage and a guide hole where the probe to be inserted;
• a monitoring part configured to display an image identified by the vision part;
• and
• a controlling part comprising a computer in which a predetermined program is embodied to control operations of the jig, the first stage, the second stage, the actuator, the vision part, the monitoring part, or the probe storage and a coordinate movement of the input guide hole.

A method of manufacturing a probe card, the method comprising:

• fabricating probes;
• preparing and combining a guide hole plate and a reference plate;
• entering coordinates of a plurality of guide holes to insert the probes and the insertion order;
• inserting a plurality of probes for contacting a test circuit of a wafer or semiconductor chip having predetermined test coordinates into a plurality of guide holes formed at positions corresponding to the test coordinates, respectively;
• preparing a MPH in which a plurality of circuits for inspecting the wafer or semiconductor chip are formed at the positions corresponding to the test coordinates;
• adding a conductive paste adhesive to each circuit of the MPH;
• aligning the MPH with the guide hole plate so that fore ends of the probes inserted to correspond to the test coordinates and the circuits of the MPH formed to correspond to the test coordinates face each other;
• manipulating the plurality of probes to be adhered upright on the circuits of the MPH by facing and contacting the MPH with an upper end surface of the guide hole plate so that the fore ends of the probes and the circuits of the MPH are in contact;
• performing a reflow process on the adhered circuit and the probes to bond the circuit and the probes;
• sequentially separating a magnet, the reference plate, and the guide hole plate from the MPH to which the probes are bonded;
• coupling the MPH with a main printed circuit board, the MPH and the main printed circuit board being electrically interconnected by electronic components and interposers;
• and
• attaching a plurality of connectors for connecting a plurality of electrical components corresponding to characteristics of the wafer or semiconductor chip to be tested and the probe card and a probe station, and fastening the deformation prevention mechanism apparatus.