Methods for dispensing and forming 3a molecular sieve hot melt entrained polymers onto substrates
AssigneeCSP Technologies, Inc.
InventorsJonathan R. Freedman, Kasey Myers, William Frederick Spano
Life of this patent
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AssigneeCSP Technologies, Inc.
InventorsJonathan R. Freedman, Kasey Myers, William Frederick Spano
Estimating the term…
Disclosed are methods for forming and adhering an entrained polymer structure to a substrate. The methods include providing a substrate configured to receive application of a molten entrained polymer. A 3 A molecular sieve entrained polymer in molten form is applied in a predetermined shape, to a surface of the substrate, to form a solidified entrained polymer structure on the substrate. The entrained polymer includes a monolithic material formed of at least a base polymer and 3 A molecular sieve. The surface of the substrate is compatible with the molten entrained polymer so as to thermally bond with it. In this way, the entrained polymer bonds to the substrate and solidifies upon sufficient cooling of the entrained polymer.
A method for forming and adhering an entrained polymer structure to a substrate, comprising the steps of:
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A method for repeatedly forming and adhering precisely shaped entrained polymer structures to a substrate in an automated package production line, the method comprising the steps of:
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A method for forming and adhering an entrained polymer strip to a substrate, comprising the steps of:
A method for forming and adhering entrained polymer structures to substrates in an automated package production line using a hot melt dispensing apparatus, the method comprising the steps of:
Dependencies are inferred from the claim text.