A high precision air bearing stage with capability of parasitic error compensation
AssigneeSanying Motioncontrol (Tianjin) Instrument Co., Ltd.
InventorsHao LIU, Ying XU, Jing JIA
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Abstract
A high-precision air floating motion platform and method for wafer test, wherein the air floating motion platform includes: a base; a beam installed on the base; a sliding table configured to carry a wafer; a linear motor configured to drive the sliding table to slide along the beam; at least three sensors configured to detect a vertical straightness of the wafer; air bearings including a first air bearing, a second air bearing and a third air bearing; the air bearings being configured for suspension of the sliding table; and a compensation device configured to compensate the vertical straightness of the wafer based on a real-time data detected by the sensors.
Claims10
A high-precision air floating motion platform for wafer test, comprising:
- a base used as a seat in the wafer test process;
- a beam installed on the base;
- a sliding table capable of sliding along a surface of the beam, and a top of the sliding table being capable of carrying a wafer;
- a linear motor configured to drive the sliding table to slide along the beam;
- at least three sensors distributed on sides of the sliding table, and configured to detect a vertical straightness of the wafer;
- air bearings comprising a first air bearing, a second air bearing and a third air bearing;
- the first air bearing and the second air bearing being configured for a side limited suspension of the sliding table, and the third air bearing being configured for a bottom limited suspension of the sliding table;
- and
- a compensation device located above the sliding table, and the compensation device being configured to compensate the vertical straightness of the wafer based on a real-time data detected by the sensors.
A wafer test method, comprising:
- S100:
- placing a wafer to be tested on a sliding table;
- S200:
- driving, by a linear motor, the sliding table to slide along a surface of a beam;
- S300:
- detecting, by at least three sensors, a vertical straightness of the wafer during a motion of the wafer;
- S400:
- compensating, by a compensation device, the vertical straightness of the wafer.
Dependencies are inferred from the claim text.