Semiconductor memory device and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsKiseok LEE, Keunnam KIM, Yongseok KIM, Hui-Jung KIM, Min Hee CHO, Yoosang HWANG
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AssigneeSamsung Electronics Co., Ltd.
InventorsKiseok LEE, Keunnam KIM, Yongseok KIM, Hui-Jung KIM, Min Hee CHO, Yoosang HWANG
Estimating the term…
A semiconductor memory device including a stack structure including layer groups that are vertically stacked on a substrate and including a word line, a channel layer, and a data storage element that is electrically connected to the channel layer; and a vertically extending bit line on one side of the stack structure, wherein the word line of each of the layer groups extends in a first direction parallel to a top surface of the substrate, the layer groups include first and second layer groups that are sequentially stacked, the channel layer is below the word line of the first layer group, the channel layer is above the word line of the second layer group, and the bit line includes a first protrusion portion connected to the channel layer of the first layer group; and a second protrusion portion connected to the channel layer of the second layer group.
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
21-25. (canceled)
Dependencies are inferred from the claim text.