Electronic device including sheilding structure

A method for manufacturing a nanofiber film, the method comprising:

• bonding a lower surface of a first layer and an upper surface of a second layer;
• bonding a lower surface of the second layer and an upper surface of a third layer;
• and
• plating the first, second and third layers with a conductive material,
• wherein an electrical resistance value of the second layer in a first direction is less than an electrical resistance value of the first layer or the third layer in the first direction.

A method for manufacturing an electronic device, the method comprising:

• preparing a circuit board, a first component disposed on the circuit board, a shield can disposed to surround at least a part of the first component and including an opening, and a nanofiber film, the nanofiber film including a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, the second layer having a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction;
• arranging a filling member comprising a thermally conductive material on an upper position of first component;
• and
• arranging the nanofiber film to shield the opening.