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US 2023/0156980 A1Published application
Power conversion device
AssigneeMitsubishi Electric Corporation
InventorsShingo KITAGAWA, Daisuke SASAKI, Kohei ANDO, Yoshifumi MIZUNO, Yoshitsugu HIRAYAMA, Hirofumi INOUE, Koji UYAMA
Life of this patent
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Abstract
In a power conversion device, a semiconductor module, a bus bar assembly, and a smoothing capacitor are superposed on a cooler in the stated order from the cooler side. At least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler.
Claims9
A power conversion device, comprising:
- a semiconductor module;
- a smoothing capacitor configured to smooth an input voltage to the semiconductor module;
- a bus bar assembly configured to electrically connect at least two of the semiconductor module, the smoothing capacitor, and a power supply;
- and
- a cooler,
- wherein the semiconductor module, the bus bar assembly, and the smoothing capacitor are superposed on the cooler in the stated order from the cooler side, and
- wherein at least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler.
4 more elements
Dependencies are inferred from the claim text.