Heat sink assembly for electronic equipment

A heat sink assembly for a cage for a field replaceable computing module, comprising:

• a heat sink to facilitate heat dissipation, the heat sink including a mating surface;
• a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to engage a heat transfer surface of the field replaceable computing module installed adjacent the heat sink;
• and
• an actuation assembly including a shape memory alloy (SMA) element coupled to the heat sink, wherein the SMA element is configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material contacts the heat transfer surface of the field replaceable computing module, and when the SMA element moves to the second position, the second surface of the thermal interface material is moved a distance away from the heat transfer surface of the field replaceable computing module.

A system comprising:

• a cage defining a chamber configured to receive a field replaceable computing module with a heat transfer surface;
• a heat sink to facilitate heat dissipation, the heat sink including a mating surface;
• a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to selectively engage the heat transfer surface of the field replaceable computing module when the field replaceable computing module is installed in the chamber of the cage;
• and
• an actuation assembly including a shape memory alloy (SMA) element coupled to the heat sink, wherein the field replaceable computing module is configured to be installed in the chamber of the cage and configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material contacts the heat transfer surface of the field replaceable computing module, and when the SMA element moves to the second position, the second surface of the thermal interface material is moved a distance away from the heat transfer surface of the field replaceable computing module.