Circuit assembly
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorsKoushi IGURA, Hiroki SHIMODA, Taiji YANAGIDA
Life of this patent
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Abstract
Provided is a circuit assembly with a novel structure that can quickly reduce heat generation at a connection portion of a heat generating component. A circuit assembly includes a heat generating component that generates heat when energized; a energization member that connects to a connection portion of the heat generating component; a fastening member that fastens the energization member to the connection portion; and a heat capacity increasing component that thermally connects to a fastening site of the energization member and the connection portion and increases a heat capacity of the connection portion of the heat generating component.
Claims12
A circuit assembly comprising:
- a heat generating component that generates heat when energized;
- an energization member that connects to a connection portion of the heat generating component;
- a fastening member that fastens the energization member to the connection portion;
- and
- a heat capacity increasing component that is thermally in contact with a fastening site of the energization member and the connection portion and increases a heat capacity of the connection portion of the heat generating component.
Dependencies are inferred from the claim text.