Heat-dissipating structure and electronic device comprising the heat-dissipating structure

An electronic device comprising:

• a housing;
• a printed circuit board disposed inside the housing and comprising an electronic component;
• and
• a heat-dissipating structure disposed adjacent to the electronic component,
• wherein the heat-dissipating structure comprises:
• a case comprising:
• a first body and a second body spaced apart from each other wherein the second body is in contact with the electronic component;
• a wick disposed in a space between the first body and the second body, the wick comprising:
• multiple wires disposed in a first direction and in a second direction intersecting the first direction, and having a passage for a working fluid, the passage being formed along at least one opening formed between the multiple wires;
• and
• a channel formed between the first body and the wick and configured to move the working fluid through the at least one opening according to a change in a state of the working fluid, and
• the at least one opening having a size determined based on an internal pressure of the wick and a flow resistance of the working fluid.