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US 2023/0156964 A1Published application
Heat sink and converter comprising same
AssigneeLG Innotek Co., Ltd.
InventorsYong Joo LEE, Mi Sun LEE, Ju Young JANG
Life of this patent
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Abstract
A heat sink according to one embodiment of the present invention comprises: a main heat sink; a heat pipe mounted in a groove formed on one surface of the main heat sink; a heat dissipation member which is formed above the heat pipe and transfers heat generated from a heat generation component to the heat pipe; and an elastic member which is mounted in a space formed inside the heat dissipation member and applies pressure to the main heat sink.
Claims21
A heat sink comprising:
- a main heat sink;
- a heat pipe mounted in a groove formed on one surface of the main heat sink;
- a heat dissipation member formed at an upper portion of the heat pipe;
- and
- an elastic member mounted in a space formed inside the heat dissipation member for applying pressure to the main heat sink.
2 more elements
8-10. (canceled)
A converter module comprising:
- a printed circuit board on which a plurality of components performing voltage conversion are mounted;
- a heat sink that serves as a contact surface in contact with an external device when the converter module is mounted on the external device and radiates heat generated in the component;
- and
- a housing covering outside of the converter module,
- wherein the heat sink comprises:
- a main heat sink;
- a heat pipe mounted in a groove formed on one surface of the main heat sink;
- a heat dissipation member formed at an upper portion of the heat pipe to transfer heat generated in the component to the heat pipe;
- and
- an elastic member mounted in a space formed inside the heat dissipation member to apply pressure to the main heat sink, and
- wherein the main heat sink is in contact with a contact surface of the external device to which the converter module is mounted by the pressure applied from the elastic member.
8 more elements
Dependencies are inferred from the claim text.