Systems and methods for thermal management of high-capacity devices in immersion-cooled datacenters
AssigneeMicrosoft Technology Licensing, LLC
InventorsBharath RAMAKRISHNAN, Husam Atallah ALISSA, Eric C. PETERSON, Nicholas Andrew KEEHN, Christian L. BELADY, Ioannis MANOUSAKIS, Dennis TRIEU
Life of this patent
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Abstract
A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.
Claims20
A method of thermal management of a computing device, the method comprising:
- immersing a first electronic component of the computing device in a first working fluid contained in a first volume;
- immersing a second electronic component of the computing device in a second working fluid contained in a second volume;
- and
- changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.
A system for immersion cooling of a server computer, the system comprising:
- an immersion tank;
- a server computer positioned in the immersion tank wherein the server computer includes at least one heat-generating component and at least one high-capacity component;
- a component tank positioned around the at least one high-capacity component;
- a first working fluid positioned in the component tank and contacting the high-capacity component, wherein the first working fluid has a first fluid pressure;
- and
- a second working fluid positioned in the immersion tank and contacting the heat-generating component, wherein the second working fluid has a second fluid pressure different than the first fluid pressure.
A system for immersion cooling of a server computer, the system comprising:
- an immersion tank;
- a first server computer positioned in the immersion tank wherein the first server computer includes:
- at least one first heat-generating component and at least one first high-capacity component;
- a first component tank positioned around the at least one first high-capacity component;
- and
- a first component working fluid positioned in the first component tank and contacting the at least one first high-capacity component, wherein the first component working fluid has a first component fluid pressure;
- and
- a second server computer positioned in the immersion tank wherein the second server computer includes:
- at least one second heat-generating component and at least one second high-capacity component;
- a second component tank positioned around the at least one second high-capacity component;
- a second component working fluid positioned in the second component tank and contacting the at least one second high-capacity component, wherein the second component working fluid has a second component fluid pressure;
- and
- a liquid working fluid positioned in the immersion tank and contacting the first heat-generating components of the first server computer and the second heat-generating components of the second server computer, wherein the liquid working fluid has a fluid pressure different than the first component fluid pressure or the second component fluid pressure.
Dependencies are inferred from the claim text.