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US 2023/0156959 A1Published application
Liquid-In-Liquid Cooling System for Electronic Components
AssigneeJetCool Technologies Inc.
InventorsBernard Malouin, Jordan Mizerak, Eric Browne
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Abstract
A cooling system and method of cooling electronic components comprising a tank (or other vessel) in which a dielectric liquid cools low power electronic components within the tank, while a conductive liquid cools high power electronic components in the tank. The conductive liquid is supplied via a plurality of cooling modules, each arranged on or in proximity to a high power component. A cooling module arranged within the tank may enclose one or more of the electronic components in the tank using a fluid-tight seal.
Claims25
A system comprising:
- a vessel for holding a first liquid;
- a first fluid inlet and a first fluid outlet for circulating the first liquid within the vessel;
- a plurality of electronic components arranged within the vessel;
- a cooling module arranged proximate to a first electronic component of the plurality of electronic components;
- and
- a second fluid inlet for supplying a second liquid into the cooling module.
3 more elements
Dependencies are inferred from the claim text.