Designing a printed circuit board (pcb) to detect slivers of conductive material included within vias of the pcb
AssigneeJuniper Networks, Inc.
InventorsSteve WILKINSON, Daniel J. PREZIOSO
Life of this patent
Estimating the term…
Abstract
A method may include obtaining a printed circuit board (PCB) that includes a set of vias that include a set of stub regions. The PCB may include a set of layers perpendicular to the set of vias. The set of layers may include a signal layer and a ground layer. The ground layer may be located between the set of stub regions and the signal layer. The method may include drilling to remove at least a portion of a stub region of a via of the set of vias. The method may include performing an electrical test to determine whether a sliver of conductive material is included within the via after drilling to remove the at least a portion of the stub region of the via.
Claims20
A method, comprising:
- drilling, by a first device, to remove at least a portion of a stub region of a via associated with a second device,
- wherein drilling to remove the at least the portion of the stub region creates a ring of conductive material around a portion of a ground layer that connects to the via and around a portion of a hole associated with the drilling;
- performing an electrical test to determine whether conductive material is included within the via after drilling to remove at least the portion of the stub region of the via;
- and
- performing, based on a result of performing the electrical test, at least one of:
- additional drilling to remove at least the portion of the stub region when the conductive material is determined to be included within the via, or
- performing an additional electrical test to determine whether the conductive material is included within the via.
A first device, comprising:
- one or more memories;
- and
- one or more processors to:
- drill to remove at least a portion of a stub region of a via associated with a second device,
- wherein drilling to remove the at least the portion of the stub region creates a ring of conductive material around a portion of a ground layer that connects to the via and around a portion of a hole associated with the drilling;
- perform an electrical test to determine whether conductive material is included
- within the via after drilling to remove at least the portion of the stub region of the via;
- and
- perform, based on a result of performing the electrical test, at least one of:
- additional drilling to remove at least the portion of the stub region when the conductive material is determined to be included within the via, or
- performing an additional electrical test to determine whether the conductive material is included within the via.
A non-transitory computer-readable medium storing a set of instructions, the set of instructions comprising:
- one or more instructions that, when executed by one or more processors of a first device, cause the first device to:
- drill to remove at least a portion of a stub region of a via associated with a second device,
- wherein drilling to remove the at least the portion of the stub region creates a ring of conductive material around a portion of a ground layer that connects to the via and around a portion of a hole associated with the drilling;
- perform an electrical test to determine whether conductive material is included
- within the via after drilling to remove at least the portion of the stub region of the via;
- and
- perform, based on a result of performing the electrical test, at least one of:
- additional drilling to remove at least the portion of the stub region when the conductive material is determined to be included within the via, or
- performing an additional electrical test to determine whether the conductive material is included within the via.
Dependencies are inferred from the claim text.