Direct wire attachment methods and apparatus for a bga component

An endoscope comprising:

• an image sensor, comprising a component mounting surface and a ball grid array (BGA), having solder balls spaced apart from each other, on the component mounting surface;
• a plurality of coaxial wires, each electrically coupled directly to a corresponding one of the solder balls of the image sensor and each extending perpendicularly relative to the component mounting surface of the image sensor;
• and
• a wire fixation element, through which the plurality of coaxial wires entirely pass through, wherein the wire fixation element is coupled to the plurality of coaxial wires and configured to fix the coaxial wires relative to each other so that the coaxial wires do not move relative to each other.

A method of making an electrical device, the method comprising steps of:

• positioning a plurality of electrical wires such that an electrical conductor of each one of the plurality of electrical wires is perpendicular to a component mounting surface of a ball grid array (BGA) component;
• soldering the electrical conductor of each one of the plurality of electrical wires, when positioned perpendicular to the component mounting surface of the BGA component, to a corresponding one of a plurality of solder balls of a BGA formed on the component mounting surface of the BGA component;
• and
• fixing together the plurality of electrical wires at a location away from the component mounting surface so that the plurality of electrical wires do not move relative to each other.