Printed circuit board

A method of manufacturing a printed circuit board, the method comprising:

• forming a first cavity penetrating through a first insulating layer having first and second surfaces opposing each other;
• disposing a first tape on the first surface of the first insulating layer;
• disposing a first electronic component in the first cavity such that at least a portion of the first electronic component is in contact with the first tape;
• disposing a second insulating layer covering the first electronic component on the first tape;
• removing the first tape;
• forming a second cavity penetrating through at least a portion of each of the first and second insulating layers;
• disposing a second tape on the second surface of the first insulating layer;
• disposing a second electronic component in the second cavity to be in contact with the second tape;
• disposing a third insulating layer covering the second electronic component on a first surface of the second insulating layer;
• and
• removing the second tape.

A printed circuit board comprising:

• a first insulating layer having first and second surfaces opposing each other, and including a first cavity penetrating through the first and second surfaces;
• a first electronic component disposed in the first cavity and including a first pad;
• a second insulating layer disposed in the first cavity to cover the first electronic component, and extending on the first and second surfaces of the first insulating layer;
• a second electronic component including a second pad and disposed in a second cavity which penetrates through the first insulating layer and the second insulating layer;
• and
• a third insulating layer disposed in the second cavity to cover the second electronic component, and extending on the second insulating layer,
• wherein the first pad and the second pad are disposed in opposite directions.