Method Of Manufacturing An Augmented LED Array Assembly
AssigneeLumileds LLC
InventorsMichael Deckers, Tze Yang Hin, Ronald Bonne
Life of this patent
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Abstract
An LED array assembly may include a hybridized device and a flexible PCB. The hybridized device may include a micro-LED array mounted on a driver IC. The driver IC may include driver IC contact pads on a top surface of the driver IC. The flexible PCB may have a bottom surface, first contact pads on the bottom surface, second contact pads on the bottom surface, and contact bridges. Each of the contact bridges extends from one of the first contact pads to one of the second contact pads. Each of the driver IC contact pads is bonded to a corresponding one of the first contact pads of the flexible PCB.
Claims20
A device comprising:
- a lighting device comprising:
- a top surface,
- a bottom surface opposite the top surface, and
- a plurality of first contact pads on the top surface;
- and
- at least one flexible printed circuit board (PCB) comprising:
- a bottom surface,
- a top surface opposite the bottom surface,
- a plurality of second contact pads on the bottom surface,
- a plurality of third contact pads on the bottom surface, and
- a plurality of contact bridges, each of the plurality of contact bridges extending from one of the plurality of second contact pads to one of the plurality of third contact pads,
- each of the plurality first contact pads being bonded to a corresponding one of the plurality of second contact pads of the flexible PCB.
A method of manufacturing a device, the method comprising:
- providing a lighting device that comprises a top surface, a bottom surface opposite the top surface, and a plurality of first contact pads on the top surface;
- providing at least one flexible printed circuit board (PCB) that comprises a bottom surface, a top surface opposite the bottom surface, a plurality of second contact pads on the bottom surface, a plurality of third contact pads on the bottom surface, and a plurality of contact bridges;
- forming solder bonds between the plurality of second contact pads of the flexible PCB and the first contacts pads of the lighting device.
An automotive lighting system comprising:
- a lighting device comprising an array of light-emitting diode (LED) emitter and having:
- a top surface,
- a bottom surface opposite the top surface, and
- a plurality of first contact pads on the top surface;
- and
- at least one flexible printed circuit board (PCB) comprising:
- a bottom surface,
- a top surface opposite the bottom surface,
- a plurality of second contact pads on the bottom surface,
- a plurality of third contact pads on the bottom surface, and
- a plurality of contact bridges, each of the plurality of contact bridges extending from one of the plurality of second contact pads to one of the plurality of third contact pads,
- each of the plurality first contact pads being bonded to a corresponding one of the plurality of second contact pads of the flexible PCB;
- and
- a driver configured to independently drive groups of the emitters, at least some components of the driver being on the lighting device and at least some components of the driver being on the flexible PCB.
Dependencies are inferred from the claim text.