Component Carrier With a Via Containing a Hardened Filling Material
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsShuying YAO, Abderrazzaq IFIS, Jens RIEDLER, Vanesa López BLANCO
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Abstract
A component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; an opening located at least partially in the stack; and a fill material which is located within the opening. The fill material is a photosensitive material, wherein at least a part of the photosensitive material has undergone a hardening treatment with electromagnetic radiation. A method for manufacturing such a component carrier is further described.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- an opening located at least partially in the stack;
- and
- a fill material which is located within the opening, wherein the fill material is a photosensitive material, wherein at least a part of the photosensitive material has undergone a hardening treatment with electromagnetic radiation.
A method for manufacturing a component carrier, the method comprising:
- providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- forming at least one opening located at least partially in the stack;
- applying a photosensitive material at a main surface of the stack such that the opening is filled at least partially with the photosensitive material;
- treating at least some regions of the applied photosensitive material such that the photosensitive material is hardened;
- and
- removing excessive hardened material such that surface portions of the main surface of the stack outside from the at least one opening are free from hardened material.
Dependencies are inferred from the claim text.