US 2023/0156909 A1Published application

Circuit board structure

AssigneeUnimicron Technology Corp.

InventorShih-Lian Cheng

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Abstract

A circuit board structure includes a first dielectric layer, first and second inner circuit layers, a conductive connection layer, a second dielectric layer, two third dielectric layers, third and fourth inner circuit layers, two conductive through vias, first and second annular retaining walls, two fourth dielectric layers, first and second external circuit layers, and third and fourth annular retaining walls. The conductive through vias penetrate the third and second dielectric layers and electrically connect the third and fourth inner circuit layers. The first and second annular retaining walls surround the conductive through vias and electrically connect the third and first and the fourth and second inner circuit layers. The third and fourth annular retaining walls are respectively disposed in the fourth dielectric layers and electrically connect the first external circuit layer and the third inner circuit layer and the second external circuit layer and the fourth inner circuit layer.

Claims10

Dependent claims

A circuit board structure, comprising:

a first dielectric layer, having a first surface and a second surface opposite to each other and an opening penetrating the first dielectric layer and connecting the first surface and the second surface;
a first inner circuit layer, disposed on the first surface of the first dielectric layer;
a second inner circuit layer, disposed on the second surface of the first dielectric layer;
a conductive connection layer, covering an inner wall of the opening of the first dielectric layer and connecting the first inner circuit layer and the second inner circuit layer;
a second dielectric layer, filling the opening of the first dielectric layer;
two third dielectric layers, respectively covering the first inner circuit layer, the second inner circuit layer, and the second dielectric layer;
a third inner circuit layer and a fourth inner circuit layer, respectively covering the third dielectric layers;
two conductive through vias, penetrating the third dielectric layers and the second dielectric layer, and electrically connecting the third inner circuit layer and the fourth inner circuit layer;
a first annular retaining wall and a second annular retaining wall, respectively disposed in the third dielectric layers, surrounding the conductive through vias, and electrically connecting the third inner circuit layer and the first inner circuit layer and the fourth inner circuit layer and the second inner circuit layer;
two fourth dielectric layers, respectively covering the third inner circuit layer and the fourth inner circuit layer;
a first external circuit layer and a second external circuit layer, respectively covering the fourth dielectric layers;
and
a third annular retaining wall and a fourth annular retaining wall, respectively disposed in the fourth dielectric layers and electrically connecting the first external circuit layer and the third inner circuit layer and the second external circuit layer and the fourth inner circuit layer.

10 more elements

A circuit board structure, comprising:

two circuit board units, each of the circuit board units comprising:
a first dielectric layer, having a first surface and a second surface opposite to each other and an opening penetrating the first dielectric layer and connecting the first surface and the second surface;
a first inner circuit layer, disposed on the first surface of the first dielectric layer;
a second inner circuit layer, disposed on the second surface of the first dielectric layer;
a conductive connection layer, covering an inner wall of the opening of the first dielectric layer and connecting the first inner circuit layer and the second inner circuit layer;
a second dielectric layer, filling the opening of the first dielectric layer;
two third dielectric layers, respectively covering the first inner circuit layer, the second inner circuit layer, and the second dielectric layer;
a third inner circuit layer and a fourth inner circuit layer, respectively covering the third dielectric layers;
two conductive through vias, penetrating the third dielectric layers and the second dielectric layer, and electrically connecting the third inner circuit layer and the fourth inner circuit layer;
a first annular retaining wall and a second annular retaining wall, respectively disposed in the third dielectric layers, surrounding the conductive through vias, and electrically connecting the third inner circuit layer and the first inner circuit layer and the fourth inner circuit layer and the second inner circuit layer;
two fourth dielectric layers, respectively covering the third inner circuit layer and the fourth inner circuit layer;
a first external circuit layer and a second external circuit layer, respectively covering the fourth dielectric layers;
and
a third annular retaining wall and a fourth annular retaining wall, respectively disposed in the fourth dielectric layers and electrically connecting the first external circuit layer and the third inner circuit layer and the second external circuit layer and the fourth inner circuit layer, wherein a part of at least one of the third annular retaining wall and the fourth annular retaining wall is disposed corresponding to the conductive through vias;
and
a connection structural layer, comprising a connection layer and a plurality of conductive bonding portions, wherein the connection layer is located between the circuit board units and covers the first external circuit layer of each of the circuit board units, and the conductive bonding portions are connected to the first external circuit layer of each of the circuit board units, so that the circuit board units are docked together.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/873,153Filed 26 Jul 2022
Priority: TW 11112428229 Jun 2022
Published: 18 May 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H05K 1/0222
Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors: for…
H05K 1/024
High frequency adaptations: dielectric details, e.g. changing the dielectric material around a transmission line
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections