Circuit board

A method of processing a circuit board, the method comprising:

• obtaining a circuit board comprising a first surface and an opposing second surface, the circuit board further comprising a ground connection;
• defining a shielding zone and a non-shielding zone on the first surface of the circuit board, wherein one or more shielding-zone electronic components are in the shielding zone;
• providing a groove at the circuit board, the groove extending along at least a part of the shielding zone and being in-between the shielding zone and the non-shielding zone;
• applying an insulating encapsulation layer to cover at least a part of the shielding zone, whereby the one or more shielding-zone electronic components are encapsulated;
• and
• applying an electrically conductive shielding layer on top of at least a part of the insulating encapsulation layer and to the ground connection so that the electrically conductive shielding layer is electrically coupled to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded.