US 2023/0156906 A1 · CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

Abstract

A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.

Claims12

Dependent claims

A circuit board assembly, comprising:

an inner circuit substrate;
a first outer circuit substrate disposed on a surface of the inner circuit substrate;
a second outer circuit substrate disposed on another surface of the inner circuit substrate away from the first outer circuit substrate;
a heat conducting block penetrating through the inner circuit substrate and connecting to each of the first outer circuit substrate and the second outer circuit substrate, and an accommodating groove with an opening towards the first outer circuit substrate defined on the heat conducting block, the heat conducting block made of aluminum nitride;
an electronic component at least partially accommodated in the accommodating groove, and the electronic component electrically connected to the first outer circuit substrate;
and
a reinforcing plate disposed on a surface of the second outer circuit substrate corresponding to the electronic component and facing away from the electronic component.

4 more elements

A method for manufacturing a circuit board assembly, the method comprising

providing an inner circuit substrate with a through hole;
placing a heat conducting block in the through hole, and the heat conducting block made of aluminum nitride;
forming a first outer circuit substrate and a second outer circuit substrate on opposite surfaces of the inner circuit substrate, the first outer circuit substrate and the second outer circuit substrate covering the heat conducting block;
forming an accommodating groove penetrating through the first outer circuit substrate and recessed toward the heat conducting block;
at least partially accommodating an electronic component in the accommodating groove;
and
forming a reinforcing plate on a surface of the second outer layer circuit substrate corresponding to the electronic component and facing away from the electronic component.

4 more elements

Dependencies are inferred from the claim text.

Circuit board assembly and method for manufacturing the same

Life of this patent

Circuit board assembly and method for manufacturing the same

Life of this patent

Abstract

Claims12