Circuit board
AssigneeSumitomo Bakelite Co., Ltd.
InventorNobuo Tagashira
Life of this patent
Estimating the term…
Abstract
A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle θ formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.
Claims6
A circuit board comprising:
- an insulating substrate;
- and
- a circuit pattern of a metal formed on the insulating substrate in direct contact with the insulating substrate,
- wherein a side surface of the circuit pattern has a region in which an angle formed by a surface of the insulating substrate and a tangential line at a middle portion in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.
Dependencies are inferred from the claim text.