Electronic device including printed circuit board structure including thermal interface material

An electronic device comprising:

• a printed circuit board structure comprising:
• a base plate;
• a cover plate;
• an interposer connected to the base plate and the cover plate and surrounding a space between the base plate and the cover plate;
• a first component on the base plate and in the space;
• a heat conduction plate on the cover plate and facing the first component;
• an accommodation part which is between the base plate and the heat conduction plate;
• and
• a thermal interface material accommodated in the accommodation part and provided in a solid state by being hardened in the accommodation part.

An electronic device comprising:

• a printed circuit board structure comprising:
• a base plate;
• a first component on the base plate;
• a second component on the base plate and apart from the first component;
• an interposer body connected to the base plate and surrounding the first component and the second component, and an interposer disposed in the interposer body and including an inlet through which an inner space of the interposer body meets the outside;
• a cover plate connected to the interposer and covering the first component and the second component;
• a heat conduction plate on the cover plate and facing the first component and the second component;
• an accommodation part including an accommodation body and an accommodation head extending from the accommodation body and included inside the inlet, wherein the accommodation body is between the base plate and the heat conduction plate;
• and
• a thermal interface material accommodated in the accommodation part and provided in a solid state by being hardened in the accommodation part.