Vehicle, a main frame, a module pocket, an electronic module, and a printed circuit board
AssigneeVolkswagen Aktiengesellschaft
InventorAndreas Aal
Life of this patent
Estimating the term…
Abstract
A central compute unit, configured as a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The printed circuit board for an electronic vehicular component includes a thermal distribution layer in the printed circuit board and one or more thermal coupling areas on the surface of the printed circuit board. The one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board, and the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
Claims21
1-20. (canceled)
A printed circuit board for an electronic vehicular component, the printed circuit board comprising:
- a thermal distribution layer in the printed circuit board;
- one or more thermal coupling areas on the surface of the printed circuit board,
- wherein the one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board and wherein the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
An electronic module for a vehicle comprising:
- a printed circuit board, comprising
- a thermal distribution layer in the printed circuit board;
- one or more thermal coupling areas on the surface of the printed circuit board,
- wherein the one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board and wherein the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
An electronic apparatus for a vehicle comprising:
- a pocket module comprising two cooling blades;
- and
- a printed circuit board coupled to the pocket module, the printed circuit board comprising
- a thermal distribution layer in the printed circuit board;
- one or more thermal coupling areas on the surface of the printed circuit board,
- wherein the one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board and wherein the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
Dependencies are inferred from the claim text.