Radio-frequency module and communication apparatus

A radio-frequency module comprising:

• a multilayer substrate including a plurality of stacked layers, the multilayer substrate having a first major face and a second major face;
• a first semiconductor device;
• a second semiconductor device;
• a mold layer sealing at least the second semiconductor device;
• and
• a shield layer covering the mold layer,
• wherein the first major face includes a first recess,
• wherein the first semiconductor device is mounted over a bottom face of the first recess,
• wherein the second semiconductor device is mounted over the first major face so as to overlie the first recess,
• wherein the first semiconductor device is connected with a metallic via, the metallic via extending through a portion of the multilayer substrate from the bottom face of the first recess to the second major face,
• wherein the mold layer does not cover a top face of the second semiconductor device, the top face of the second semiconductor device being a face of the second semiconductor device opposite from a face near the first major face, and
• wherein the shield layer is in contact with the top face of the second semiconductor device.