Additive manufacturing of electrical circuits

An electronics assembly comprising:

• a base layer;
• a first thermally and electrically conductive intermediate layer formed over the base layer with an additive manufacturing process;
• an electronics component disposed over the first thermally and electrically conductive intermediate layer, wherein the electronics component comprises a plurality of vias;
• and
• a second thermally and electrically conductive intermediate layer formed over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween.

A method of manufacturing an electronics assembly, the method comprising:

• forming a base layer;
• forming a first thermally and electrically conductive intermediate layer onto the base layer using the additive manufacturing process;
• placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias;
• and
• forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using the additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween.