Light emitting diode package
AssigneeSamsung Electronics Co., Ltd.
InventorsJongho LIM, Jaehyuk LIM, Hosik JUN, Hyojeong KANG, Yonggi CHO
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Abstract
A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.
Claims20
A light-emitting diode (LED) package, comprising:
- a substrate including an insulating material;
- upper pads on an upper surface of the substrate;
- a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads;
- an LED chip on the upper surface of the substrate and electrically connected to the upper pads;
- a fluorescent layer on the LED chip;
- and
- a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon,
- wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.
A light-emitting diode (LED) package, comprising:
- a substrate;
- lower pads on a lower surface of the substrate;
- upper pads on an upper surface of the substrate;
- an LED chip on the upper surface of the substrate and electrically connected to the upper pads;
- a fluorescent layer on the LED chip;
- a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon;
- and
- a side surface molding layer covering a portion of the upper surface of the substrate, side surfaces of the upper pads, and side surfaces of the lower pads, the side surface molding layer including a cup portion horizontally surrounding the LED chip, the fluorescent layer, and the reflection molding layer,
- wherein:
- an upper surface of the cup portion is farther from the substrate in a vertical direction than an upper surface of the fluorescent layer is from the substrate in the vertical direction, and
- an internal surface of the side surface molding layer that faces the LED chip is outwardly inclined with respect to the upper surface of the substrate.
A light-emitting diode (LED) package, comprising:
- a substrate including aluminum oxide;
- upper pads on an upper surface of the substrate;
- an LED chip on the upper surface of the substrate and electrically connected to the upper pads;
- a fluorescent layer on the LED chip, the fluorescent layer including phosphor-in-glass (PiG);
- a side surface molding layer covering a portion of the upper surface of the substrate and side surfaces of the upper pads, the side surface molding layer including a cup portion horizontally surrounding the LED chip and the fluorescent layer;
- and
- a reflection molding layer covering the LED chip and inside surfaces of the cup portion of the side surface molding layer, the reflection molding layer exposing at least a portion of side surfaces of the fluorescent layer,
- wherein an upper surface of the reflection molding layer is inclined with respect to the upper surface of the substrate such that the inclined upper surface of the reflection molding layer has a structure in which a portion of the upper surface of the reflection molding layer distal to the LED chip is farther from the upper surface of the substrate in a vertical direction than a portion of the upper surface of the reflection molding layer proximate to the LED chip is from the upper surface of the substrate in the vertical direction.
Dependencies are inferred from the claim text.