Display panel and manufacturing method thereof
AssigneeShenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorJunling LIU
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Abstract
The present application discloses a display panel and a manufacturing method thereof. The display panel manufacturing method includes forming an LED die including a sacrificial layer on an array substrate, and then coating black glue material on the array substrate. The black glue material covers the array substrate and a surface of the sacrificial layer away from the array substrate. Then, the black glue material and the sacrificial layer are heated, and the black glue material is cured to form a black glue layer such that the sacrificial layer is decomposed. The display panel and the manufacturing method thereof provided by the present application are for improving contrast of the display panel.
Claims20
A display panel manufacturing method, comprising steps as follows:
- providing an array substrate, wherein the array substrate comprises a first surface and a second surface disposed oppositely;
- forming a light emitting diode (LED) die including a sacrificial layer on the first surface, wherein the LED die is disposed on the array substrate, and the sacrificial layer is disposed on a surface of the LED die away from the array substrate;
- coating a black glue material on the array substrate, wherein the black glue material covers the first surface and covers a surface of the sacrificial layer away from the array substrate;
- and
- heating the black glue material and the sacrificial layer under a predetermined temperature such that the black glue material is cured to form a black glue layer and the sacrificial layer is decomposed.
A display panel manufacturing method, comprising steps as follows:
- providing an array substrate, wherein the array substrate comprises a first surface and a second surface disposed oppositely;
- coating a material of a sacrificial layer on a light emitting diode (LED) die to form the LED die including the sacrificial layer, wherein the LED die is disposed on the array substrate, and the sacrificial layer is disposed on a surface of the LED die away from the array substrate;
- coating a black glue material on the array substrate, wherein the black glue material covers the first surface and covers a surface of the sacrificial layer away from the array substrate;
- heating the black glue material and the sacrificial layer under a predetermined temperature such that the black glue material is cured to form a black glue layer and the sacrificial layer is decomposed;
- performing a cleaning process and an air drying process on the surface of the LED die away from the array substrate;
- and
- forming a transparent glue layer on a surface of the black glue layer away from the array substrate, wherein the transparent glue layer covers the LED die.
Dependencies are inferred from the claim text.